JPH083017Y2 - 半導体装置の容器 - Google Patents

半導体装置の容器

Info

Publication number
JPH083017Y2
JPH083017Y2 JP1989138565U JP13856589U JPH083017Y2 JP H083017 Y2 JPH083017 Y2 JP H083017Y2 JP 1989138565 U JP1989138565 U JP 1989138565U JP 13856589 U JP13856589 U JP 13856589U JP H083017 Y2 JPH083017 Y2 JP H083017Y2
Authority
JP
Japan
Prior art keywords
plating
insulating substrate
leads
semiconductor device
container
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP1989138565U
Other languages
English (en)
Japanese (ja)
Other versions
JPH0377440U (en]
Inventor
茂美 若松
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp filed Critical NEC Corp
Priority to JP1989138565U priority Critical patent/JPH083017Y2/ja
Publication of JPH0377440U publication Critical patent/JPH0377440U/ja
Application granted granted Critical
Publication of JPH083017Y2 publication Critical patent/JPH083017Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Die Bonding (AREA)
  • Lead Frames For Integrated Circuits (AREA)
JP1989138565U 1989-11-29 1989-11-29 半導体装置の容器 Expired - Lifetime JPH083017Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1989138565U JPH083017Y2 (ja) 1989-11-29 1989-11-29 半導体装置の容器

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1989138565U JPH083017Y2 (ja) 1989-11-29 1989-11-29 半導体装置の容器

Publications (2)

Publication Number Publication Date
JPH0377440U JPH0377440U (en]) 1991-08-05
JPH083017Y2 true JPH083017Y2 (ja) 1996-01-29

Family

ID=31685658

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1989138565U Expired - Lifetime JPH083017Y2 (ja) 1989-11-29 1989-11-29 半導体装置の容器

Country Status (1)

Country Link
JP (1) JPH083017Y2 (en])

Also Published As

Publication number Publication date
JPH0377440U (en]) 1991-08-05

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Legal Events

Date Code Title Description
EXPY Cancellation because of completion of term